CN201272857Y

CN201272857Y - Electronic glass-fiber cloth capable of preventing weave exposure of circuit board

Info

Publication number: CN201272857Y
Application number: CNU2008201527799U
Authority: CN
Inventors: 谢坤洲
Original assignee: SHANGHAI HONGHE ELECTRONIC MATERIAL CO Ltd
Current assignee: SHANGHAI HONGHE ELECTRONIC MATERIAL CO Ltd
Priority date: 2008-09-05
Filing date: 2008-09-05
Publication date: 2009-07-15
Anticipated expiration: 2018-09-05

Abstract

The utility model discloses electronic glass fiber fabric capable of preventing weave of a circuit substrate from exposing, which is formed by weaving warp threads and weft threads. The electronic glass fiber fabric is characterized in that each beam of warp threads is composed of 380-400 single filaments, the diameter of each single filament is 6-6.5 microns, each beam of weft threads is composed of 380-400 single filaments, the diameter of each single filament is 6-6.5 microns, the weight per unit area of the fiber fabric is 93-97 g/m<2>. The electronic glass fiber fabric capable of preventing circuit board weave exposing reduces the weight per unit area, can obviously improve weave exposing conditions on a 4 mil (0.1mm) substrate of the printed circuit board manufactured by the electronic glass fiber fabric, besides, for resin can be sufficiently reacted with the electronic glass fiber fabric, the heat resistance is increased.

Description

Can prevent the electronics glass cloth that the circuit substrate weavy grain appears

Technical field

The utility model relates to a kind of cloth that prevents that the circuit substrate weavy grain from appearing.

Background technology

Electronics glass cloth mainly is to be used for producing tellite, when producing some low resin content specification substrate, the problem that weavy grain appears often occurs, and therefore causes the heat resistance of substrate to descend.It is exactly that the electronics glass is furnished with part and protrudes on the resin bed that weavy grain appears, and is not covered by resin fully, and the substrate of thickness 4mil (0.1mm) especially is at present with weight per unit area 105g/m ²Electronics glass cloth (2116 model) produce, the resin content of substrate is about 43～44%, generally have 10～20% weavy grain and appear problem, though use 2113 of low weight per unit area, but head it offs such as 2313 or 3313 models, but the electronics cloth price of this type of model is higher, and present domestic copper-clad plate merchant is reluctant to switch for cost consideration.

The utility model content

The utility model provides a kind of electronics glass cloth that prevents that the circuit substrate weavy grain from appearing according to deficiency of the prior art.

For achieving the above object, the utility model is achieved through the following technical solutions:

A kind of electronics glass cloth that prevents that the circuit substrate weavy grain from appearing, form by warp thread and weft yarn braiding, it is characterized in that, every bundle warp thread is made up of 380-400 root monofilament, every filament diameter 6-6.5 micron, every bundle weft yarn is made up of 380-400 root monofilament, every filament diameter 6-6.5 micron, and the weight per unit area of described cloth is 93-97g/m ²

Wherein, preferred described every bundle warp thread is made up of 400 monofilament, 6.3 microns of every filament diameters; The weight per unit area of described cloth is 95g/m ²

Wherein, preferred described every bundle weft yarn is made up of 400 monofilament, 6.3 microns of every filament diameters; The weight per unit area of described cloth is 95g/m ²

The electronics glass cloth that prevented circuit substrate weavy grain in the utility model appears, reduced the weight of unit are, printed circuit base board with its making, the weavy grain that the substrate that can obviously improve 4mil (0.1mm) of glass cloth occurs appears situation, and because resin and electronics glass cloth can fully react, heat resistance also obtains to improve.

Description of drawings

Fig. 1 is the electronics glass cloth section structure schematic diagram in the utility model;

The specific embodiment

Below in conjunction with accompanying drawing the utility model is further specified.

As shown in Figure 1, a kind of electronics glass cloth that prevents that the circuit substrate weavy grain from appearing, form by warp thread 1 and weft yarn 2 braidings, every bundle warp thread is made up of 400 monofilament, 6.3 microns of every filament diameters, every bundle weft yarn is made up of 400 monofilament, 6.3 microns of every filament diameters, and the weight per unit area of described cloth is 95g/m ²

The foregoing description only is used for the utility model is described, and does not constitute the restriction to the claim scope, and other substantial equivalence means that it may occur to persons skilled in the art that are all in the utility model claim scope.

Claims

1. electronics glass cloth that can prevent that the circuit substrate weavy grain from appearing, form by warp thread and weft yarn braiding, it is characterized in that, every bundle warp thread is made up of 380-400 root monofilament, every filament diameter 6-6.5 micron, every bundle weft yarn is made up of 380-400 root monofilament, every filament diameter 6-6.5 micron, and the weight per unit area of described cloth is 93-97g/m ²

2. the electronics glass cloth that prevents that the circuit substrate weavy grain from appearing according to claim 1 is characterized in that described every bundle warp thread is made up of 400 monofilament, 6.3 microns of every filament diameters; The weight per unit area of described cloth is 95g/m ²

3. the electronics glass cloth that prevents that the circuit substrate weavy grain from appearing according to claim 1 is characterized in that described every bundle weft yarn is made up of 400 monofilament, 6.3 microns of every filament diameters; The weight per unit area of described cloth is 95g/m ²1.